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Intel Prestonia™ Folded Fin

This Intel Xeon™ based passive folded fin heatsink is designed with an Al fin/Cu base. The design incorporates an aluminum shroud attached to the base. The heatsink weight is 466 grams with an envelop dimension of: 88.9mm-L x 63.5mm-W x 50.4mm-H. The attachment hardware is ordered separately. Thermal interface material can be applied per customer request.

Heatsinks - BGA
Extrusions/Cold Forgings
Custom Heatsinks


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