 | Radial
Radial fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height. All Radial Heat Sinks can be customized to meet your design requirements.
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| Tyco PN | 2-1542005-3 |
| Package Size | 23 mm (0.91 in) |
| No. of Fins | 6 |
| Diameter | 34.92 mm (1.37 in) |
| Height | 20.24 mm (0.80 in) |
| Power | 5,10,15 Watts |
Thermal Resistence
5W @ 0LFM | 10.67 |
Thermal Resistence
5W @ 200LFM | 4.10 |
Thermal Resistence
5W @ 400LFM | 3.31 |
Thermal Resistence
5W @ 600LFM | 2.25 |
Thermal Resistence
10W @ 0LFM | 9.85 |
Thermal Resistence
10W @ 200LFM | 4.19 |
Thermal Resistence
10W @ 400LFM | 3.03 |
Thermal Resistence
10W @ 600LFM | 2.16 |
Thermal Resistence
15W @ 0LFM | 8.94 |
Thermal Resistence
15W @ 200LFM | 3.93 |
Thermal Resistence
15W @ 400LFM | 2.97 |
Thermal Resistence
15W @ 600LFM | 2.14 |
| Material | Aluminum |
| Finish | Black Anodized |
| Flame Rating | UL94-V0 |
Thermal Resistence Chart |
