 | Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.
Need A Quote or More Information? |
| Tyco PN | 4-1542001-2 |
| Package Size | 21 mm (0.83 in) |
| Diameter | 34.92 mm (1.37 in) |
| Height | 12.70 mm (0.50 in) |
| Power | 5,10,15 Watts |
Thermal Resistence
5W @ 0LFM | 12.88 |
Thermal Resistence
5W @ 200LFM | 6.97 |
Thermal Resistence
5W @ 400LFM | 4.95 |
Thermal Resistence
5W @ 600LFM | 3.95 |
Thermal Resistence
10W @ 0LFM | 11.24 |
Thermal Resistence
10W @ 200LFM | 6.66 |
Thermal Resistence
10W @ 400LFM | 4.82 |
Thermal Resistence
10W @ 600LFM | 3.88 |
Thermal Resistence
15W @ 0LFM | 10.27 |
Thermal Resistence
15W @ 200LFM | 6.53 |
Thermal Resistence
15W @ 400LFM | 4.60 |
Thermal Resistence
15W @ 600LFM | 3.82 |
| Material | Forged Aluminum |
| Finish | Black Anodized |
| Flame Rating | UL94-V0 |
Thermal Resistence Chart |
