 | Pin Fin (Passive) Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.
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Tyco PN | 4-1542001-2 |
Package Size | 21 mm (0.83 in) |
Diameter | 34.92 mm (1.37 in) |
Height | 12.70 mm (0.50 in) |
Power | 5,10,15 Watts |
Thermal Resistence 5W @ 0LFM | 12.88 |
Thermal Resistence 5W @ 200LFM | 6.97 |
Thermal Resistence 5W @ 400LFM | 4.95 |
Thermal Resistence 5W @ 600LFM | 3.95 |
Thermal Resistence 10W @ 0LFM | 11.24 |
Thermal Resistence 10W @ 200LFM | 6.66 |
Thermal Resistence 10W @ 400LFM | 4.82 |
Thermal Resistence 10W @ 600LFM | 3.88 |
Thermal Resistence 15W @ 0LFM | 10.27 |
Thermal Resistence 15W @ 200LFM | 6.53 |
Thermal Resistence 15W @ 400LFM | 4.60 |
Thermal Resistence 15W @ 600LFM | 3.82 |
Material | Forged Aluminum |
Finish | Black Anodized |
Flame Rating | UL94-V0 |
Thermal Resistence Chart |