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29mm BGA Pin Fin (Passive)

Calgreg PN: CGAC29-0014 Heatsink

Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Tyco PN7-1542007-4
Package Size29 mm (1.14 in)
Diameter34.92 mm (1.37 in)
Height12.70 mm (0.50 in)
Power5,10,15 Watts
Thermal Resistence
5W @ 0LFM
12.44
Thermal Resistence
5W @ 200LFM
7.13
Thermal Resistence
5W @ 400LFM
5.19
Thermal Resistence
5W @ 600LFM
3.85
Thermal Resistence
10W @ 0LFM
11.06
Thermal Resistence
10W @ 200LFM
7.11
Thermal Resistence
10W @ 400LFM
5.06
Thermal Resistence
10W @ 600LFM
3.68
Thermal Resistence
15W @ 0LFM
10.08
Thermal Resistence
15W @ 200LFM
6.93
Thermal Resistence
15W @ 400LFM
4.95
Thermal Resistence
15W @ 600LFM
3.60
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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