 | Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.
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| Package Size | 37.5 mm (1.48 in) |
| Diameter | 50.80 mm (2.00 in) |
| Height | 19.05 mm (0.75 in) |
| Power | 5,10,15 Watts |
Thermal Resistence
5W @ 0LFM | 7.28 |
Thermal Resistence
5W @ 200LFM | 3.40 |
Thermal Resistence
5W @ 400LFM | 2.20 |
Thermal Resistence
5W @ 600LFM | 1.75 |
Thermal Resistence
10W @ 0LFM | 6.64 |
Thermal Resistence
10W @ 200LFM | 3.51 |
Thermal Resistence
10W @ 400LFM | 2.40 |
Thermal Resistence
10W @ 600LFM | 1.88 |
Thermal Resistence
15W @ 0LFM | 6.27 |
Thermal Resistence
15W @ 200LFM | 3.54 |
Thermal Resistence
15W @ 400LFM | 2.34 |
Thermal Resistence
15W @ 600LFM | 1.91 |
| Material | Forged Aluminum |
| Finish | Black Anodized |
| Flame Rating | UL94-V0 |
Thermal Resistence Chart |
