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35mm BGA Pin Fin (Passive)

Calgreg PN: CGAC35-0009 Heatsink

Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Tyco PN4-1542002-7
Package Size35 mm (1.38 in)
Diameter34.92 mm (1.37 in)
Height12.70 mm (0.50 in)
Power5,10,15 Watts
Thermal Resistence
5W @ 0LFM
10.22
Thermal Resistence
5W @ 200LFM
5.74
Thermal Resistence
5W @ 400LFM
4.45
Thermal Resistence
5W @ 600LFM
3.20
Thermal Resistence
10W @ 0LFM
9.44
Thermal Resistence
10W @ 200LFM
5.88
Thermal Resistence
10W @ 400LFM
4.59
Thermal Resistence
10W @ 600LFM
3.39
Thermal Resistence
15W @ 0LFM
8.76
Thermal Resistence
15W @ 200LFM
5.82
Thermal Resistence
15W @ 400LFM
4.65
Thermal Resistence
15W @ 600LFM
3.49
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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