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32.5mm BGA Pin Fin (Passive)

Calgreg PN: CGAC325-0009 Heatsink

Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Tyco PN1-1542002-6
Package Size32.5 mm (1.28 in)
Diameter50.80 mm (2.00 in)
Height19.05 mm (0.75 in)
Power5,10,15 Watts
Thermal Resistence
5W @ 0LFM
7.28
Thermal Resistence
5W @ 200LFM
3.40
Thermal Resistence
5W @ 400LFM
2.20
Thermal Resistence
5W @ 600LFM
1.75
Thermal Resistence
10W @ 0LFM
6.64
Thermal Resistence
10W @ 200LFM
3.51
Thermal Resistence
10W @ 400LFM
2.40
Thermal Resistence
10W @ 600LFM
1.88
Thermal Resistence
15W @ 0LFM
6.27
Thermal Resistence
15W @ 200LFM
3.54
Thermal Resistence
15W @ 400LFM
2.34
Thermal Resistence
15W @ 600LFM
1.91
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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