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32.5mm BGA Pin Fin (Passive)

Calgreg PN: CGAC325-0019 Heatsink

Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Tyco PN8-1542005-7
Package Size32.5 mm (1.28 in)
Diameter34.41 mm (1.35 in)
Height27.94 mm (1.10 in)
Power5,10,15 Watts
Thermal Resistence
5W @ 0LFM
7.36
Thermal Resistence
5W @ 200LFM
3.15
Thermal Resistence
5W @ 400LFM
2.40
Thermal Resistence
5W @ 600LFM
1.60
Thermal Resistence
10W @ 0LFM
6.46
Thermal Resistence
10W @ 200LFM
3.36
Thermal Resistence
10W @ 400LFM
2.45
Thermal Resistence
10W @ 600LFM
1.88
Thermal Resistence
15W @ 0LFM
6.36
Thermal Resistence
15W @ 200LFM
3.36
Thermal Resistence
15W @ 400LFM
2.55
Thermal Resistence
15W @ 600LFM
1.95
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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