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31mm BGA Pin Fin (Passive)

Calgreg PN: CGAC31-0028 Heatsink

Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Tyco PN9-15420001-4
Package Size31 mm (1.22 in)
Diameter50.80 mm (2.00 in)
Height27.94 mm (1.10 in)
Power5,10,15 Watts
Thermal Resistence
5W @ 0LFM
6.57
Thermal Resistence
5W @ 200LFM
2.85
Thermal Resistence
5W @ 400LFM
2.56
Thermal Resistence
5W @ 600LFM
1.85
Thermal Resistence
10W @ 0LFM
5.82
Thermal Resistence
10W @ 200LFM
2.79
Thermal Resistence
10W @ 400LFM
2.40
Thermal Resistence
10W @ 600LFM
1.77
Thermal Resistence
15W @ 0LFM
5.38
Thermal Resistence
15W @ 200LFM
2.73
Thermal Resistence
15W @ 400LFM
2.34
Thermal Resistence
15W @ 600LFM
1.71
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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