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27mm BGA Pin Fin (Passive)

Calgreg PN: CGAC27-0017 Heatsink

Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Package Size27 mm (1.06 in)
Diameter50.80 mm (2.00 in)
Height19.05 mm (0.75 in)
Power5,10,15 Watts
Thermal Resistence
5W @ 0LFM
7.66
Thermal Resistence
5W @ 200LFM
4.20
Thermal Resistence
5W @ 400LFM
3.15
Thermal Resistence
5W @ 600LFM
2.50
Thermal Resistence
10W @ 0LFM
6.97
Thermal Resistence
10W @ 200LFM
4.01
Thermal Resistence
10W @ 400LFM
2.99
Thermal Resistence
10W @ 600LFM
2.35
Thermal Resistence
15W @ 0LFM
6.51
Thermal Resistence
15W @ 200LFM
3.90
Thermal Resistence
15W @ 400LFM
2.95
Thermal Resistence
15W @ 600LFM
2.28
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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