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23mm BGA Pin Fin (Passive)

Calgreg PN: CGAC23-0011 Heatsink

Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Tyco PN2-1542008-8
Package Size23 mm (0.91 in)
Diameter50.80 mm (2.00 in)
Height27.94 mm (1.10 in)
Power5,10,15 Watts
Thermal Resistence
5W @ 0LFM
7.28
Thermal Resistence
5W @ 200LFM
3.35
Thermal Resistence
5W @ 400LFM
2.55
Thermal Resistence
5W @ 600LFM
2.25
Thermal Resistence
10W @ 0LFM
6.37
Thermal Resistence
10W @ 200LFM
3.22
Thermal Resistence
10W @ 400LFM
2.42
Thermal Resistence
10W @ 600LFM
2.13
Thermal Resistence
15W @ 0LFM
6.00
Thermal Resistence
15W @ 200LFM
3.18
Thermal Resistence
15W @ 400LFM
2.38
Thermal Resistence
15W @ 600LFM
2.09
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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