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23mm BGA Pin Fin (Passive)

Calgreg PN: CGAC23-0005 Heatsink

Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Tyco PN1-1542005-7
Package Size23 mm (0.91 in)
Diameter34.41 mm (1.35 in)
Height27.94 mm (1.10 in)
Power5,10,15 Watts
Thermal Resistence
5W @ 0LFM
9.09
Thermal Resistence
5W @ 200LFM
3.90
Thermal Resistence
5W @ 400LFM
3.10
Thermal Resistence
5W @ 600LFM
2.60
Thermal Resistence
10W @ 0LFM
8.26
Thermal Resistence
10W @ 200LFM
3.91
Thermal Resistence
10W @ 400LFM
2.89
Thermal Resistence
10W @ 600LFM
2.52
Thermal Resistence
15W @ 0LFM
7.93
Thermal Resistence
15W @ 200LFM
3.80
Thermal Resistence
15W @ 400LFM
2.92
Thermal Resistence
15W @ 600LFM
2.49
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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