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23mm BGA Pin Fin (Passive)

Calgreg PN: CGAC23-0003 Heatsink

Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Package Size23 mm (0.91 in)
Diameter34.92 mm (1.37 in)
Height19.05 mm (0.75 in)
Power5,10,15 Watts
Thermal Resistence
5W @ 0LFM
11.21
Thermal Resistence
5W @ 200LFM
5.54
Thermal Resistence
5W @ 400LFM
3.60
Thermal Resistence
5W @ 600LFM
3.05
Thermal Resistence
10W @ 0LFM
9.66
Thermal Resistence
10W @ 200LFM
5.41
Thermal Resistence
10W @ 400LFM
3.51
Thermal Resistence
10W @ 600LFM
2.94
Thermal Resistence
15W @ 0LFM
8.82
Thermal Resistence
15W @ 200LFM
5.21
Thermal Resistence
15W @ 400LFM
3.31
Thermal Resistence
15W @ 600LFM
2.88
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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