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21mm BGA Pin Fin (Passive)

Calgreg PN: CGAC21-0018 Heatsink

Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Package Size21 mm (0.83 in)
Diameter50.80 mm (2.00 in)
Height12.70 mm (0.50 in)
Power5,10,15 Watts
Thermal Resistence
5W @ 0LFM
10.13
Thermal Resistence
5W @ 200LFM
6.14
Thermal Resistence
5W @ 400LFM
4.40
Thermal Resistence
5W @ 600LFM
3.45
Thermal Resistence
10W @ 0LFM
9.03
Thermal Resistence
10W @ 200LFM
5.82
Thermal Resistence
10W @ 400LFM
4.30
Thermal Resistence
10W @ 600LFM
3.36
Thermal Resistence
15W @ 0LFM
8.30
Thermal Resistence
15W @ 200LFM
5.82
Thermal Resistence
15W @ 400LFM
4.34
Thermal Resistence
15W @ 600LFM
3.31
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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