 | Pin Fin (Passive)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.
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| Tyco PN | 3-1542005-6 |
| Package Size | 25 mm (0.98 in) |
| Diameter | 34.41 mm (1.35 in) |
| Height | 27.94 mm (1.10 in) |
| Power | 5,10,15 Watts |
Thermal Resistence
5W @ 0LFM | 9.09 |
Thermal Resistence
5W @ 200LFM | 3.90 |
Thermal Resistence
5W @ 400LFM | 3.10 |
Thermal Resistence
5W @ 600LFM | 2.60 |
Thermal Resistence
10W @ 0LFM | 8.26 |
Thermal Resistence
10W @ 200LFM | 3.91 |
Thermal Resistence
10W @ 400LFM | 2.89 |
Thermal Resistence
10W @ 600LFM | 2.52 |
Thermal Resistence
15W @ 0LFM | 7.93 |
Thermal Resistence
15W @ 200LFM | 3.80 |
Thermal Resistence
15W @ 400LFM | 2.92 |
Thermal Resistence
15W @ 600LFM | 2.49 |
| Material | Forged Aluminum |
| Finish | Black Anodized |
| Flame Rating | UL94-V0 |
Thermal Resistence Chart |
