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30.5mm BGA Pin Fin (Active)

Calgreg PN: CGAC305-0019 Heatsink

Pin Fin (Active)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Tyco PN6-1542005-9
Package Size30.5 mm (1.2 in)
Diameter50.80 mm (2.00 in)
Height37.94 mm (1.49 in)
Power5,10,15 Watts
Thermal Resistence
5W w/Fan
1.28
Thermal Resistence
10W w/Fan
1.32
Thermal Resistence
15W w/Fan
1.35
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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