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23mm BGA Pin Fin (Active)

Calgreg PN: CGAC23-0012 Heatsink

Pin Fin (Active)
Pin fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height.

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Tyco PN2-1542005-0
Package Size23 mm (0.91 in)
Diameter50.80 mm (2.00 in)
Height37.94 mm (1.49 in)
Power5,10,15 Watts
Thermal Resistence
5W w/Fan
1.63
Thermal Resistence
10W w/Fan
1.66
Thermal Resistence
15W w/Fan
1.65
MaterialForged Aluminum
FinishBlack Anodized
Flame RatingUL94-V0

Thermal Resistence Chart

Thermal Resistance Chart



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