Our new Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top™ BGA Sockets require no external hold-downs and use less PC board space than most test sockets. The patent-pending pressure retention clamp, with integral heat sink, ensures a reliable connection.

• No soldering of the BGA device required.
• Same footprint as BGA device.
• Compact, low-profile design maximizes PC board space and requires no external hold-downs.
• Available with integral, finned heat sink or coin-screw retention clamp.
• Surface mount and thru-hole designs available.